| We can provide wire bonding services for prototypes,
R&D or rework.
No job is too small. We can do ball
bonding or wedge bonding with wire ranging from .7 mil to 20 mil. We can
also provide ribbon bonding or deep access as well as die bonding.
We also have pull testing capabilities,
either destruct on non-destruct.
Contact us
today for more information.
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